Part Number/Keyword

XCZU19EG-1FFVC1760I

Manufacturer Part Number XCZU19EG-1FFVC1760I
Manufacturer Xilinx Inc.
Package / Case 1760-BBGA, FCBGA
D/C 17+
Unit Price -
Quantity 34
Datasheets XCZU19EG-1FFVC1760I.pdf
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XCZU19EG-1FFVC1760I Specifications
Description IC FPGA 512 I/O 1760FCBGA
Series Zynq® UltraScale+™ MPSoC EG
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
MCU Flash -
MCU RAM 256KB
Peripherals DMA, WDT
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 1760-FCBGA (42.5x42.5)

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Embedded - System On Chip (SoC)

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Embedded - DSP (Digital Signal Processors)

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